MP 1513-026D – Technical Data Sheet
Thermally conductive gap filler for the thermal connection of SMD components and capacitors.
Product description
Thermally conductive gap filler for the thermal connection of SMD components and capacitors. The product is used for example in automotive applications, in medical technology or in notebooks.
| Property | Value |
|---|---|
| Supporting Base | Silicone ceramic filled |
| Reinforcement | fiberglass laminate |
| Colour | grey / red |
| Total thickness in mm | 8.0 |
| Hardness in Shore 00 | 15 |
Thermal properties
| Property | Value |
|---|---|
| Thermal conductivity in W/mK | 2.4 |
| Flammability according to UL 94 | V0 |
| Temperature range in °C | -40 up to +200 |
Electrical properties
| Property | Value |
|---|---|
| Dielectric strength in kV/mm | >4 13 |
| Volume resistivity in ohm x cm | 1.7 x 10 |
Other properties
-
both sides weakly adhesive
-
one side reinforced with fiberglass laminate
-
thermal conductivity of 2.4 W/mK
-
operates at lowest pressures
-
extremely soft and compliable
-
extraordinary chemical resistance and longterm
stability
-
easy mounting through natural self tackiness
-
residue-free removal after use
The technical data are average values and do not replace the user's own testing. Subject to change without notice. The PDF data sheet is binding.